型号
像元数
像元尺寸
像元中心距
暗电流
电容
封装
引脚数
封装类型
窗口
FCI-InGaAs-4M 4 × 1 Ø75 μm 250 μm 0.03 nA@-5V 0.65 pF@-5V Ceramic Submount Chip -
FCI-InGaAs-12M 12 × 1 Ø75 μm 250 μm 0.03 nA@-5V 0.65 pF@-5V Ceramic Submount Chip -
FCI-InGaAs-8M 8 × 1 Ø75 μm 250 μm 0.03 nA@-5V 0.65 pF@-5V Ceramic Submount Chip -
FCI-InGaAs-16M 16 × 1 Ø75 μm 250 μm 0.03 nA@-5V 0.65 pF@-5V Ceramic Submount Chip -
FCI-InGaAs-300B1X4 4 × 1 Ø300 μm 500 μm 0.05 nA@-5V 8 pF@-5V Ceramic Submount Chip -
FCI-InGaAs-300B1X8 8 × 1 Ø300 μm 500 μm 0.05 nA@-5V 8 pF@-5V Ceramic Submount Chip -
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