型号	像元数	像元尺寸	像元中心距	暗电流	电容	封装	引脚数	封装类型	窗口
FCI-InGaAs-4M	4 × 1	Ø75 μm	250 μm	0.03 nA@-5V	0.65 pF@-5V	Ceramic Submount		Chip	-
FCI-InGaAs-12M	12 × 1	Ø75 μm	250 μm	0.03 nA@-5V	0.65 pF@-5V	Ceramic Submount		Chip	-
FCI-InGaAs-8M	8 × 1	Ø75 μm	250 μm	0.03 nA@-5V	0.65 pF@-5V	Ceramic Submount		Chip	-
FCI-InGaAs-16M	16 × 1	Ø75 μm	250 μm	0.03 nA@-5V	0.65 pF@-5V	Ceramic Submount		Chip	-
FCI-InGaAs-300B1X4	4 × 1	Ø300 μm	500 μm	0.05 nA@-5V	8 pF@-5V	Ceramic Submount		Chip	-
FCI-InGaAs-300B1X8	8 × 1	Ø300 μm	500 μm	0.05 nA@-5V	8 pF@-5V	Ceramic Submount		Chip	-